7: Surface Imaging and Depth Profiling
- Page ID
- 25354
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\(\newcommand{\avec}{\mathbf a}\) \(\newcommand{\bvec}{\mathbf b}\) \(\newcommand{\cvec}{\mathbf c}\) \(\newcommand{\dvec}{\mathbf d}\) \(\newcommand{\dtil}{\widetilde{\mathbf d}}\) \(\newcommand{\evec}{\mathbf e}\) \(\newcommand{\fvec}{\mathbf f}\) \(\newcommand{\nvec}{\mathbf n}\) \(\newcommand{\pvec}{\mathbf p}\) \(\newcommand{\qvec}{\mathbf q}\) \(\newcommand{\svec}{\mathbf s}\) \(\newcommand{\tvec}{\mathbf t}\) \(\newcommand{\uvec}{\mathbf u}\) \(\newcommand{\vvec}{\mathbf v}\) \(\newcommand{\wvec}{\mathbf w}\) \(\newcommand{\xvec}{\mathbf x}\) \(\newcommand{\yvec}{\mathbf y}\) \(\newcommand{\zvec}{\mathbf z}\) \(\newcommand{\rvec}{\mathbf r}\) \(\newcommand{\mvec}{\mathbf m}\) \(\newcommand{\zerovec}{\mathbf 0}\) \(\newcommand{\onevec}{\mathbf 1}\) \(\newcommand{\real}{\mathbb R}\) \(\newcommand{\twovec}[2]{\left[\begin{array}{r}#1 \\ #2 \end{array}\right]}\) \(\newcommand{\ctwovec}[2]{\left[\begin{array}{c}#1 \\ #2 \end{array}\right]}\) \(\newcommand{\threevec}[3]{\left[\begin{array}{r}#1 \\ #2 \\ #3 \end{array}\right]}\) \(\newcommand{\cthreevec}[3]{\left[\begin{array}{c}#1 \\ #2 \\ #3 \end{array}\right]}\) \(\newcommand{\fourvec}[4]{\left[\begin{array}{r}#1 \\ #2 \\ #3 \\ #4 \end{array}\right]}\) \(\newcommand{\cfourvec}[4]{\left[\begin{array}{c}#1 \\ #2 \\ #3 \\ #4 \end{array}\right]}\) \(\newcommand{\fivevec}[5]{\left[\begin{array}{r}#1 \\ #2 \\ #3 \\ #4 \\ #5 \\ \end{array}\right]}\) \(\newcommand{\cfivevec}[5]{\left[\begin{array}{c}#1 \\ #2 \\ #3 \\ #4 \\ #5 \\ \end{array}\right]}\) \(\newcommand{\mattwo}[4]{\left[\begin{array}{rr}#1 \amp #2 \\ #3 \amp #4 \\ \end{array}\right]}\) \(\newcommand{\laspan}[1]{\text{Span}\{#1\}}\) \(\newcommand{\bcal}{\cal B}\) \(\newcommand{\ccal}{\cal C}\) \(\newcommand{\scal}{\cal S}\) \(\newcommand{\wcal}{\cal W}\) \(\newcommand{\ecal}{\cal E}\) \(\newcommand{\coords}[2]{\left\{#1\right\}_{#2}}\) \(\newcommand{\gray}[1]{\color{gray}{#1}}\) \(\newcommand{\lgray}[1]{\color{lightgray}{#1}}\) \(\newcommand{\rank}{\operatorname{rank}}\) \(\newcommand{\row}{\text{Row}}\) \(\newcommand{\col}{\text{Col}}\) \(\renewcommand{\row}{\text{Row}}\) \(\newcommand{\nul}{\text{Nul}}\) \(\newcommand{\var}{\text{Var}}\) \(\newcommand{\corr}{\text{corr}}\) \(\newcommand{\len}[1]{\left|#1\right|}\) \(\newcommand{\bbar}{\overline{\bvec}}\) \(\newcommand{\bhat}{\widehat{\bvec}}\) \(\newcommand{\bperp}{\bvec^\perp}\) \(\newcommand{\xhat}{\widehat{\xvec}}\) \(\newcommand{\vhat}{\widehat{\vvec}}\) \(\newcommand{\uhat}{\widehat{\uvec}}\) \(\newcommand{\what}{\widehat{\wvec}}\) \(\newcommand{\Sighat}{\widehat{\Sigma}}\) \(\newcommand{\lt}{<}\) \(\newcommand{\gt}{>}\) \(\newcommand{\amp}{&}\) \(\definecolor{fillinmathshade}{gray}{0.9}\)- 7.1: Basic concepts in surface imaging and localized spectroscopy
- This page discusses surface spectroscopic techniques that use different particle fluxes to investigate surfaces, typically covering large areas but also allowing for focused analysis on smaller regions. It emphasizes the significance of spatial resolution in improving these techniques and mentions two primary methods for achieving localization in surface analysis.
- 7.2: Electron Microscopy - SEM and SAM
- This page explains two important types of electron microscopy: Secondary Electron Microscopy (SEM) and Scanning Auger Microscopy (SAM). SEM captures detailed surface images by detecting secondary electrons, achieving resolutions better than 5 nm, which is ideal for semiconductor structures. Conversely, SAM maps composition by collecting Auger electrons from ionized atoms, with a resolution of 15-20 nm due to signal constraints.
- 7.3: Imaging XPS
- This page covers advancements in X-ray photoelectron spectroscopy (XPS) for surface analysis, detailing techniques like limited area analysis and focused X-ray scanning. While spatial resolution is typically around 100 µm, some advanced systems reach below 5 µm. Despite resolution challenges compared to electron microscopy, imaging XPS provides significant insights in materials science.
- 7.4: SIMS - Imaging and Depth Profiling
- This page details Secondary Ion Mass Spectrometry (SIMS), highlighting its surface imaging and depth profiling abilities. It focuses on the use of pulsed ion sources and time-of-flight mass spectrometers to improve signal quality, achieve high spatial resolution under 50 nm, and reduce surface damage. SIMS is particularly suited for analyzing layered structures in semiconductors, with depth resolution influenced by ion beam uniformity and sputtering.
- 7.5: Auger Depth Profiling
- This page discusses Auger spectroscopy, a non-destructive, surface-sensitive technique that analyzes compositional variations using a broad-focused electron beam over a large area. It describes the process of Auger Depth Profiling, where controlled sputtering removes material to reveal buried layers as their elemental signals fluctuate during etching, allowing for detailed analysis of sub-surface composition.
- 7.6: Scanning Probe Microscopy - STM and AFM
- This page covers the development of Scanning Tunneling Microscopy (STM) and Scanning Probe Microscopy (SPM) techniques, including Atomic Force Microscopy (AFM), in the early 1980s by IBM scientists. These techniques allow for atomic-level imaging by utilizing interactions between a probe and a surface. Key factors include accurate positioning and sharp tips. Although SPM has significantly impacted surface science, data interpretation can be complex, and traditional methods are still relevant.